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High NA EUV Lithography

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Big chipmakers are already committed to using ASML's next-generation production technology by as soon as 2028

Major chipmakers like Samsung and TSMC are committing to ASML's next-generation High NA EUV lithography technology, with volume manufacturing expected by 2028 and 2030 respectively. This advanced technology, already in limited use by Intel and SK Hynix, promises faster production, higher yields, and more efficient chipmaking, driven by the significant demand from the AI industry.