Intel targets India for a new $3.3 billion factory that will make the base substrates for its next generation of chips
Intel plans to invest $3.3 billion in partnership with 3D Glass Solutions, Inc. to build a semiconductor substrate manufacturing facility in Odisha, India. The plant, expected to take six years to complete, will produce high-density interconnect and advanced packaging glass core substrates. This initiative is part of India's 'Make in India' program aimed at boosting domestic manufacturing.
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- Entities
- Investment
- Intel
- Micron
- SK Hynix
- Tata Electronics
- Semiconductor Manufacturing
- Advanced Packaging
- TSMC
- Samsung
- 3D Glass Solutions, Inc.
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