Intel targets India for a new $3.3 billion factory that will make the base substrates for its next generation of chips
Intel plans to invest $3.3 billion in partnership with 3D Glass Solutions, Inc. to build a semiconductor substrate manufacturing facility in Odisha, India. The plant, expected to take six years to complete, will produce high-density interconnect and advanced packaging glass core substrates. This initiative is part of India's 'Make in India' program aimed at boosting domestic manufacturing.
- Entities
- Topic: Investment
- Company: Intel
- Company: Micron
- Company: SK Hynix
- Company: Tata Electronics
- Topic: Semiconductor Manufacturing
- Topic: Advanced Packaging
- Company: TSMC
- Company: Samsung
- Company: 3D Glass Solutions, Inc.
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