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Advanced Packaging
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Intel has reportedly made advancements in advanced packaging technology, enabling larger chip designs. Meanwhile, AMD's Helios Rack is said to be significantly more expensive than NVIDIA's Vera system.
PC Gamer
Intel targets India for a new $3.3 billion factory that will make the base substrates for its next generation of chips
Intel plans to invest $3.3 billion in partnership with 3D Glass Solutions, Inc. to build a semiconductor substrate manufacturing facility in Odisha, India. The plant, expected to take six years to complete, will produce high-density interconnect and advanced packaging glass core substrates. This initiative is part of India's 'Make in India' program aimed at boosting domestic manufacturing.
