OpenAI's hilarious new patent diagrams have 'HBM stacked up like rice cakes'

OpenAI has filed a patent for a new chip architecture that stacks High Bandwidth Memory (HBM) chiplets with compute chiplets using embedded logic bridges. The patent, published on April 2, 2026, aims to overcome the ~6 mm communication distance limit imposed by the JEDEC standard, leading to humorous comparisons of the stacked memory to 'rice cakes' on social media.

• Entities
• Topic: High Bandwidth Memory
• Topic: Artificial Intelligence
• Company: OpenAI
• Topic: Chip Architecture