High Bandwidth Memory
Ongoing coverage on High Bandwidth Memory.
Latest coverage
RAM, SSDs to Face “Significantly Reduced” Supply Throughout 2027 – Rumor
A rumor suggests that RAM and SSD supply will be significantly reduced through 2027, with major manufacturers Samsung, SK Hynix, and Micron reportedly selling out their fabrication capacity. This scarcity is expected to prioritize AI companies and potentially lead to price increases for consumer products and next-generation consoles like the PlayStation 5 and future Xbox models. While Sony has secured enough RAM for PlayStation 5 production until fiscal year 2027, future price hikes are possible.
US lawsuit accuses Samsung, SK Hynix and Micron of worsening the RAM crisis by fixing memory prices and supply
Samsung, SK Hynix, and Micron are facing a US class-action lawsuit accusing them of fixing RAM prices and supply, thereby worsening the global memory crisis. The lawsuit alleges the companies colluded to shift production from consumer RAM to High Bandwidth Memory for AI data centers, reducing overall supply and driving up prices since 2022. Micron has stated they disagree with the allegations and will defend themselves.
It looks like Nvidia's AI inference GPU won't see the light of day this year, which could actually be good…
Nvidia's dedicated AI inference GPU, Rubin CPX, is reportedly cancelled or significantly delayed, with no PCB or GDDR7 orders indicating a halt in production. This development, potentially linked to a licensing deal with Groq, could positively impact the pricing of Nvidia's GeForce RTX 50-series graphics cards by alleviating VRAM supply constraints.
OpenAI's hilarious new patent diagrams have 'HBM stacked up like rice cakes'
OpenAI has filed a patent for a new chip architecture that stacks High Bandwidth Memory (HBM) chiplets with compute chiplets using embedded logic bridges. The patent, published on April 2, 2026, aims to overcome the ~6 mm communication distance limit imposed by the JEDEC standard, leading to humorous comparisons of the stacked memory to 'rice cakes' on social media.
Gaming GPU Memory Tech Powers Micron’s Cheaper AI Hardware Push
Micron is developing a new AI hardware strategy by stacking up to four layers of GDDR memory modules, typically used in gaming GPUs, to significantly reduce costs. This approach aims to make AI hardware more affordable, with testing planned for this year and early samples potentially available in 2027. While this could benefit AI adoption, it may also impact the availability and pricing of gaming hardware due to increased demand for GDDR memory.
